SIGURD MICROELECTRONICS CORPORATION
ISO 9001:2015
The production testing of integrated circuits in wafer and package form. The manufacture of trimmed integrated circuits. The manufacture of wafer grinding and DPS (Die and Pick place Service).
IATF 16949:2016 basierend 6ter Ausgabe IATF Zertifizierungsvorgaben
The manufacture of trimmed integrated circuits.
ANSI/ESD S20.20 2021
The production testing of integrated circuits in wafer and package form. The manufacture of trimmed integrated circuits. The manufacture of wafer grinding and DPS (Die and Pick place Service).