Unimicron Technology Corp. (IC Carrier SBU)
This certification belongs to the parent company 20003411 Unimicron Technology Corp. (IC Carrier SBU)
The manufacture of IC carriers including substrates for Ball Grid Array (BGA), Land Grid Array (LGA) and Flip Chip Package.
IATF 16949:2016
The manufacture of IC carriers including substrates for Ball Grid Array (BGA), Land Grid Array (LGA) and Flip Chip Package.